【The pioneer of sputtering process equipment in Taiwan】

LINCOTEC, which was founded in 1999, has professional technical teams from a variety of fields, including semiconductor equipment, IC packaging, and optoelectronic technology, with a focus on core technologies (thin film process, plasma technology, AI, automation), process equipment, and heat dissipation modules development. Advanced semiconductor packing, advanced semiconductor carrier materials, next-generation displays, advanced heat dissipation substrates, green energy technology applications, and compound semiconductors are all included in the market layout.

In 2010, LINCOTEC pioneered conformal shielding sputtering equipment for the key process of SiP system packaging, which is used in B5G smartphones, wearable devices (Watch, TWS headset, AR/VR wearable devices), Internet of Things (IoT), and Internet of Vehicles (V2X), among other industries.

LINCOTEC expanded foundry business investment in 2021, focusing on product development of semiconductor materials applied to heat-dissipating substrates, developing thin-film heat-dissipating substrate manufacturing processes with semiconductor process technology, and replacing existing domestic wet processes with dry environmental protection processes to drive domestic industrial technology upgrades and development in response to government directives. The company's goal of "zero emission of green energy and reduction of secondary pollution" is realized through the "2050 Net Zero Carbon Emissions" policy.

LINCOTEC has established itself as the world's largest market share and world-class benchmark for semiconductor system-in-package (SiP) sputtering equipment. Thin-film process total solutions with high-quality and reliable process equipment and technical support services are provided by this company.

In the Top 2000 Survey-Manufacturing Survey, CommonWealth Magazine placed LINCOTEC 12th among the 50 fastest-growing firms in 2021.